Showing results: 16 - 30 of 137 items found.
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BCM91250E -
Broadcom Limited
The BCM91250E is a full-length PCI evaluation board with the SiByte® BCM1250 dual-processor System on a Chip. The board is designed for software development and for developing PCI applications that require high-performance processors.
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7945 -
Chroma ATE Inc.
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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ASML
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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MediaLB System -
Microchip Technology Inc.
A MediaLB system consists of several MediaLB devices and one MediaLB controller (typically an INIC chip). The INIC serves as a transceiver for the MOST network and as a controller for MediaLB, which assures synchronization to the MOST network.
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Exodus Advanced Communications
Exodus Pulse SSPA products feature LDMOS and GaN discrete and Chip & Wire technologies covering frequency ranges from 1MHz to 12GHz at power levels exceeding 1KW for Modules and 10KW for Systems.
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RocketSim -
Cadence Design Systems
Complementing compiled-code simulators, Cadence® RocketSim™ parallel simulation engine eliminates functional verification bottlenecks by speeding up simulation using commonly available multi-core servers. The engine is proven for register-transfer level (RTL) system on chip (SoC), gate-level functional simulation, and gate-level design for test (DFT) simulation in numerous marquee systems and semiconductor companies in the mobile, server, and graphics domains. Ever-growing chip density and complexity slow down simulation, making functional verification a severe bottleneck. As a result, chip design projects miss their time-to-market targets, or designers end up taping out early with less confidence. RocketSim parallel simulation engine solves the bottleneck common in existing compiled-code simulators by offloading the time-consuming calculations to an ultrafast multi-core engine.
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Intego GmbH
Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Synopsys, Inc.
Synopsys ZeBu® emulation system delivers the performance needed to make verification teams and software developers working on the most advanced chips successful. ZeBu emulation systems are modular, allowing users to deploy the capacity needed in a scalable and easily extensible fashion.
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ComEth4050e -
ELMA Electronic, Inc.
The ComEth 4050e is a cutting-edge 6U cPCI Layer 2/3 Ethernet switch for PICMG 2.16 & VITA 31.1 systems and is powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
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ETF-SERIES -
Envisys Technologies
Precise Temperature Accuracies with Reliable Test Results Temperature Limits: -40/-60 °C to 30 °C Temperature Accuracies: ±2-3°C Temperature Rate of Change: 20-25 deg /min (Non-linear) Maintenance Free Access to The System Self-Sufficient System Compact with small footprints suitable for any space constraint laboratories Low decibel system Suitable for testing electronic chips / devices Environmentally friendly refrigerants Efficient heating Microprocessor based single set point PID temperature controller with data logging Flexible hose up to 2.5-3.0m Interchangeable heads according to chip size. Inbuilt electrical control panel with switchgear system
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Exodus Advanced Communications
Exodus Narrowband CW and Linearized SSPA products feature LDMOS, GaN,GaAsFET discrete and Chip & Wire Hybrid technologies covering frequency ranges from 1MHz to 26.5GHz at power levels exceeding 1KW for Modules and 10KW for Systems
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Analog Devices Inc.
Analog Devices wideband transceiver ICs offer a complete, high performance RF and mixed-signal system on a chip. ADI’s ISM transceivers for short range wireless systems and wideband transceivers for wireless applications such as UMTS, LTE, and 3G/4G are highly integrated and deliver best-in-class performance and significant BOM savings.
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PAS 5500 -
ASML
In 1991, seven years after the company was founded, we launched the PAS 5500, which turned out to be our breakthrough platform. This system was able to dramatically reduce manufacturing times for our customers, and its modular design enabled them to produce multiple generations of advanced chips using the same system.
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Giga-snaP™ -
Ironwood Electronics
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Exodus Advanced Communications
Exodus Broadband SSPA products feature LDMOS, GaN, GaAsFET discrete and Chip & Wire Hybrid technologies covering one octave through decades frequency ranges from 1MHz to 24.5GHz at power levels exceeding 500W for Modules and 3KW for Systems.
